Various applications of acoustic data to deep-seabed

Title
Various applications of acoustic data to deep-seabed
Author(s)
주종민; 최지웅; 고영탁; 김종욱; 박상준; Michael; 손승규; 이경용; 문재운; 지상범
KIOST Author(s)
Ko, Young Tak(고영탁)Kim, Jonguk(김종욱)Son, Seung Kyu(손승규)Chi, Sang Bum(지상범)
Alternative Author(s)
주종민; 고영탁; 김종욱; 박상준; Michael; 손승규; 이경용; 문재운; 지상범
Publication Year
2016-11-18
Abstract
For several decades, marine scientists have used highly elaborate sonar techniques to record bathymetric and acoustic backscatter images in a wide variety of seafloor environments. These sonar systems are vital to our understanding of volcanism and tectonics and are also invaluable tools for locating mineral deposits in the deep oceans. Regarding the latter, it is required that marine mineral deposits (e.g., Fe-Mn crust, manganese nodules and hydrothermal vents) are evaluated for spatial distribution and resource potential. In exploring the vast seafloor, it is common to link high resolution geophysical methods such as deep-tow side-scan sonar (DTSSS) and remotely operated vehicles (ROV), with lower resolution systems such as multibeam echo sounders (MBES). Here we present the measurement results of our multi-scale investigations of the deep-sea floor using MBES, DTSSS and ROV.nism and tectonics and are also invaluable tools for locating mineral deposits in the deep oceans. Regarding the latter, it is required that marine mineral deposits (e.g., Fe-Mn crust, manganese nodules and hydrothermal vents) are evaluated for spatial distribution and resource potential. In exploring the vast seafloor, it is common to link high resolution geophysical methods such as deep-tow side-scan sonar (DTSSS) and remotely operated vehicles (ROV), with lower resolution systems such as multibeam echo sounders (MBES). Here we present the measurement results of our multi-scale investigations of the deep-sea floor using MBES, DTSSS and ROV.
URI
https://sciwatch.kiost.ac.kr/handle/2020.kiost/24313
Bibliographic Citation
The 37th Symposium on Ultrasonic Eletronics(USE) 2016, pp.3P6-2, 2016
Publisher
Proceedings of Symposium on Ultrasonics Electronics
Type
Conference
Language
English
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