Various applications of acoustic data to deep-seabed
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Title
- Various applications of acoustic data to deep-seabed
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Author(s)
- 주종민; 최지웅; 고영탁; 김종욱; 박상준; Michael; 손승규; 이경용; 문재운; 지상범
- KIOST Author(s)
- Ko, Young Tak(고영탁); Kim, Jonguk(김종욱); Son, Seung Kyu(손승규); Chi, Sang Bum(지상범)
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Alternative Author(s)
- 주종민; 고영탁; 김종욱; 박상준; Michael; 손승규; 이경용; 문재운; 지상범
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Publication Year
- 2016-11-18
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Abstract
- For several decades, marine scientists have used highly elaborate sonar techniques to record bathymetric and acoustic backscatter images in a wide variety of seafloor environments. These sonar systems are vital to our understanding of volcanism and tectonics and are also invaluable tools for locating mineral deposits in the deep oceans. Regarding the latter, it is required that marine mineral deposits (e.g., Fe-Mn crust, manganese nodules and hydrothermal vents) are evaluated for spatial distribution and resource potential. In exploring the vast seafloor, it is common to link high resolution geophysical methods such as deep-tow side-scan sonar (DTSSS) and remotely operated vehicles (ROV), with lower resolution systems such as multibeam echo sounders (MBES). Here we present the measurement results of our multi-scale investigations of the deep-sea floor using MBES, DTSSS and ROV.nism and tectonics and are also invaluable tools for locating mineral deposits in the deep oceans. Regarding the latter, it is required that marine mineral deposits (e.g., Fe-Mn crust, manganese nodules and hydrothermal vents) are evaluated for spatial distribution and resource potential. In exploring the vast seafloor, it is common to link high resolution geophysical methods such as deep-tow side-scan sonar (DTSSS) and remotely operated vehicles (ROV), with lower resolution systems such as multibeam echo sounders (MBES). Here we present the measurement results of our multi-scale investigations of the deep-sea floor using MBES, DTSSS and ROV.
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URI
- https://sciwatch.kiost.ac.kr/handle/2020.kiost/24313
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Bibliographic Citation
- The 37th Symposium on Ultrasonic Eletronics(USE) 2016, pp.3P6-2, 2016
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Publisher
- Proceedings of Symposium on Ultrasonics Electronics
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Type
- Conference
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Language
- English
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